As many know, Intel has recently released their new line of processors, with a code name Ivy Bridge. Quite a few have noticed that these are a little hotter than the predecessor, Sandy Bridge. Why could this be?
Ivy Bridge managed to shrink transistors into sizes of 22nm, the smallest so far. This means that more transistors will be able to give off heat in a given area. The other big thing that Ivy Bridge brought is the fact that its die is 3D. By this, it means transistors connect not only on a 2d plane, but also expand upwards. This would cause the transistors sandwiched by other hot transistors and the main part of the CPU would not be able to dissipate heat. This could very easily be the reason for which Ivy Bridge is pretty bad at overclocking compared to the last generation.
For the following portion: if you are afraid of thinking about other dimensions, you can just browse some of the other posts, though this shouldn’t be too scary.
Perhaps if Intel managed to make the connection to the metal plate on the top of the CPU 4 Dimensional – not necessarily time and space, but just another dimension – the metal would have contact with every part of the die, so Ivy Bridge would stay cooler. Then CPUs could get really thick and stick out like RAM does.
Now if Intel were to have the technology to build 4 dimensional metal, they would also build 4d dies to increase transistor’s ability to communicate. This would get pretty toasty, so Intel might have to find a way to construct 5D metal…